The GS-GSPAK1 is a collection of (6) SOIC and SSOP to DIP Adapter Sockets, which allow the user to solder popular pin-configured surface mount integrated circuits onto a platform that is easily adaptable to solderless breadboards or existing circuit layouts. Once the surface mount IC is mounted to the DIP adapter, it becomes re-usable in prototyping applications, similar to other through-hole ICs, saving time and money. The GS-GSPAK1 is perfect for educational prototyping and experiment applications, as well as production retrofits and daughter board configurations. Set of six adapter boards in an array of convenient sizes Can be used with Global Specialties Electronic Trainers, Premium and Economy Prototyping Solderless Breadboards Ideal for service, prototype and experimental and educational use Small footprint. Approximately the same size as DIP socket equivalent component Individual boards available in high quantities for production retrofits Made in USA